Weicon Tb Flex F 0,2 Kg

WEICON TB Flex F is a white, flame-retardant, trowelable 2-component adhesive. It is suitable for applications in the fire safety sector and is used to fix wear protection ceramics or steel parts to a wide variety of substrates, such as metal, concrete or similar. The adhesive system is very adhesive, hard-flexible after curing and has been modified to be impact-resistant. Even under the most extreme conditions, the adhesive does not become brittle. It shows good wear protection properties in particle erosion, has good chemical resistance and is free of solvents. TB Flex F contains additives that trigger self-extinction within a few seconds. It was examined in accordance with DIN EN ISO 340 at the DMT in Dortmund and successfully passed the test.

Application

For processing, we recommend an ambient temperature of 20°C (68°C) at less than 85% relative humidity. The highest adhesive strength is achieved when the parts to be processed are heated to >35°C (>95°F) before application. For a thin pre-coat, work WEICON TB intensively into the surface in crosswise layers using the Contour Spatula Flexy, in order to achieve maximum adhesion. By means of this technique, the epoxy resin penetrates well into all cracks and roughness depths. Afterwards, further applications can be carried out straight away, until the desired layer thickness is reached. Make sure that the epoxy resin is applied evenly and without air bubbles. To fill large gaps or holes, fibreglass, expanded metal or other mechanical fixing materials should be used. Finally, the surface can be smoothed easily with the help of a PE film and a rubber roller.

Curing

Final hardness is reached after 48 hours at 20°C (68°F) at the latest. At lower temperatures, the curing can be accelerated by evenly applying heat up to max. 40°C (104°F), e.g. with a heating pack, hot air blower or fan heater. Higher temperatures shorten the curing time. The following rule of thumb applies: Each increase by +10°C (50°F) above room temperature (20°C/68°F) will decrease the curing time by half. Temperatures below 16°C (61°F) increase the curing time, until at approx. 5°C (41°F) and below, almost no reaction will take place at all.