Weicon C Epoxy Resin 200 G

WEICON C is a temperature-resistant and flowable epoxy resin system especially for industrial use. The adhesive is non-corrosive, anti-magnetic and cures practically without shrinkage. WEICON C is particularly suitable as an adhesive for large-scale applications, for pouring out moulds and for the production of fixing devices and tools (e.g. injection moulds). It can be used in the tool and mould making sector as well as in many other industrial areas subjected to high thermal stress.

Application

For processing, we recommend an ambient temperature of 20°C (68°C) at less than 85% relative humidity. The highest adhesive strength is achieved when the parts to be processed are heated to >35°C (>95°F) before application. For a thin pre-coat, work WEICON C intensively into the surface in crosswise layers using the Contour Spatula Flexy or a paint brush to achieve maximum adhesion. By means of this technique, the epoxy resin penetrates well into all cracks and roughness depths. Afterwards, further applications can be carried out straight away, until the desired layer thickness is reached. Make sure that the epoxy resin is applied evenly and without air bubbles.