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MYR - RM
Search results for "lead solder 228 melting"
Specification Tables
1 results
Soldering & Brazing Equipment
20 Items
Series
BCuP-2, RBCuZn-D, RBCuZn-C
AWS Classification
BCuP-3, BCuP-5
Liquidus
1,460 Degrees F, 1,495 Degrees F, 1,475 Degrees F, 1,630 Degrees F
Minimum Brazing Temperature
1,350 Degrees F, 1,325 Degrees F, 1,300 Degrees F, 1,720 Degrees F
Diameter
3/16 in, 1/4 in, 5/32 in, 1/16 in
Products
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RM
220.07
Rs Pro 8007668 Wire, 1.27mm
Lead
Free
Solder
,
228
°C
Melting
Point
Enquire us
Rs Pro 7568865 Wire, 1.27mm
Lead
Free
Solder
,
228
°C
Melting
Point
Enquire us
Rs Pro 8007636 Wire, 0.25mm
Lead
Free
Solder
,
228
°C
Melting
Point
Enquire us
Rs Pro 8007630 Wire, 1.01mm
Lead
Free
Solder
,
228
°C
Melting
Point
Enquire us
Rs Pro 7568862 Wire, 0.81mm
Lead
Free
Solder
,
228
°C
Melting
Point
RM
344.45
Rs Pro 7568887 Wire, 0.38mm
Lead
Free
Solder
,
228
°C
Melting
Point
RM
350.11
Rs Pro 8007664 Wire, 1.01mm
Lead
Free
Solder
,
228
°C
Melting
Point
RM
230.42
Rs Pro 8007677 Wire, 0.81mm
Lead
Free
Solder
,
228
°C
Melting
Point
1
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