Plastic Metal Gl 0,5 Kg
The epoxy resin system WEICON GL provides high abrasion resistance and serves as wear protection for heavily used surfaces. It is flowable, has a high initial strength, is mineral-filled, and resistant to chemicals. It is particularly suitable for lining heavily stressed pump casings, as wear protection for slide bearings, chutes, funnels and pipes and for the repair of castings, valves and fan blades. The product can be used in mechanical and plant engineering, in equipment engineering, and in many other areas of industry. WEICON GL is also well-suited for creating a system structure in combination with WEICON Ceramic BL. Due to the different colours of the two wear protection systems, the degree of wear can be easily determined by visual inspection.
Application
For processing, we recommend an ambient temperature of 20°C (68°C) at less than 85% relative humidity. The highest adhesive strength is achieved when the parts to be processed are heated to >35°C (>95°F) before application. For a thin pre-coat, work WEICON GL intensively into the surface in crosswise layers using a paint brush to achieve maximum adhesion. By means of this technique, the epoxy resin penetrates well into all cracks and roughness depths. Afterwards, a second application with a paint brush or foam roller can be carried out straight away, until the desired layer thickness is reached. Make sure that the epoxy resin is applied evenly and without air bubbles. For a system build-up, WEICON Ceramic BL can be applied after 3.5 hours (layer sequence time). The two wear protection systems differ in colour and thus help to visually determine the degree of wear.
Curing
Final hardness is reached after 24 hours at 20°C (68°F) at the latest. At lower temperatures, the curing can be accelerated by evenly applying heat up to max. 40°C (104°F), e.g. with a heating pack, hot air blower or fan heater. Higher temperatures shorten the curing time. The following rule of thumb applies: Each increase by +10°C (50°F) above room temperature (20°C/68°F) will decrease the curing time by half. Temperatures below 16°C (61°F) increase the curing time, until at approx. 5°C (41°F) and below, almost no reaction will take place at all.
