WEICON

环氧胶

Epoxy

Epoksi

อีพ็อกซี่

epoxy

施工

Construction

construction

Konstruksi

Pembinaan

การก่อสร้าง

粘合剂

Sealant

sealant

Bahan Pengedap

ซีลแลนท์

WEICON C is a   temperature-resistant and flowable epoxy resin system especially for   industrial use. The adhesive is non-corrosive, anti-magnetic and cures   practically without shrinkage. WEICON C is particularly suitable as an   adhesive for large-scale applications, for pouring out moulds and for the   production of fixing devices and tools (e.g. injection moulds). It can be   used in the tool and mould making sector as well as in many other industrial   areas subjected to high thermal stress.    

For processing, we   recommend an ambient temperature of 20°C (68°C) at less than 85% relative   humidity. The highest adhesive strength is achieved when the parts to be   processed are heated to >35°C (>95°F) before application. For a thin   pre-coat, work WEICON C intensively into the surface in crosswise layers   using the Contour Spatula Flexy or a paint brush to achieve maximum adhesion.   By means of this technique, the epoxy resin penetrates well into all cracks   and roughness depths. Afterwards, further applications can be carried out   straight away, until the desired layer thickness is reached. Make sure that   the epoxy resin is applied evenly and without air bubbles.    

<h3 class="md-block-header-three">Weicon C Epoxy Resin 200 G </h3>WEICON C is a temperature-resistant and flowable epoxy resin system especially for industrial use. The adhesive is non-corrosive, anti-magnetic and cures practically without shrinkage. WEICON C is particularly suitable as an adhesive for large-scale applications, for pouring out moulds and for the production of fixing devices and tools (e.g. injection moulds). It can be used in the tool and mould making sector as well as in many other industrial areas subjected to high thermal stress. Application For processing, we recommend an ambient temperature of 20°C (68°C) at less than 85% relative humidity. The highest adhesive strength is achieved when the parts to be processed are heated to &gt;35°C (&gt;95°F) before application. For a thin pre-coat, work WEICON C intensively into the surface in crosswise layers using the Contour Spatula Flexy or a paint brush to achieve maximum adhesion. By means of this technique, the epoxy resin penetrates well into all cracks and roughness depths. Afterwards, further applications can be carried out straight away, until the desired layer thickness is reached. Make sure that the epoxy resin is applied evenly and without air bubbles.

<h3>Weicon C Epoxy Resin 200 G </h3>
WEICON C is a temperature-resistant and flowable epoxy resin system especially for industrial use. The adhesive is non-corrosive, anti-magnetic and cures practically without shrinkage. WEICON C is particularly suitable as an adhesive for large-scale applications, for pouring out moulds and for the production of fixing devices and tools (e.g. injection moulds). It can be used in the tool and mould making sector as well as in many other industrial areas subjected to high thermal stress.&nbsp;&nbsp;&nbsp;&nbsp;
Application&nbsp;
For processing, we recommend an ambient temperature of 20°C (68°C) at less than 85% relative humidity. The highest adhesive strength is achieved when the parts to be processed are heated to &gt;35°C (&gt;95°F) before application. For a thin pre-coat, work WEICON C intensively into the surface in crosswise layers using the Contour Spatula Flexy or a paint brush to achieve maximum adhesion. By means of this technique, the epoxy resin penetrates well into all cracks and roughness depths. Afterwards, further applications can be carried out straight away, until the desired layer thickness is reached. Make sure that the epoxy resin is applied evenly and without air bubbles.&nbsp;&nbsp;&nbsp;&nbsp;

Datasheet Weicon C Epoxy Resin 200 G

Weicon 10100002 C Epoxy Resin 200 G

weicon 10100002 epoxy resin 200 epoksi weicon/威康 环氧树脂 环氧胶 威康

weicon-10100002-c-epoxy-resin-200-g

Merek:	WEICON
Model:	10100002

Resin Epoksi Weicon C 200 G